1 / 3 www.asb.co.kr november 2008 p lerow tm aln020 7 internally matched lna module parameter unit specifications min typ max frequency range mhz 200 215 gain db 34 35 gain flatness db ? 0.2 ? 0.3 noise figure (nf) db 0.8 0.85 output ip3 (1) dbm 36 37 s11 / s22 (2) db - 20 / - 20 output p1db dbm 2 0 21 switching time (3) ? sec - supply current ma 160 180 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 +vcc other s ground s 21 = 35.2 db @ 200 mhz = 34.8 db @ 215 mhz nf of 0.8 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application b and in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. ou t line drawing (unit: mm) feature s specifications (in pr o duction) note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performan ce, as shown in the dra w ing at the left side. description aln0207 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) typ . @ t = 25 ? c, v s = 5 v, freq. = 207 mhz, z o.sys = 50 ohm c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type
2 / 3 www.asb.co.kr november 2008 p lerow tm aln020 7 internally matched lna module s - param e ters oip3 p1db 200~215 mhz +5 v s - parameters & k fa c tor typical performance (measured) noise figure
3 / 3 www.asb.co.kr november 2008 p lerow tm aln020 7 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac n oise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the app lication fr e quency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln series C 13x13mm)
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